BU-K319

Intel® 14th/13th/12th Gen. Core™ Processor Industrial Micro-ATX Motherboard
•Featuring Intel® 14th/13th/12th Gen. Core™ i9/i7/i5/i3 & Pentium®/Celeron® Processors
•Optional Intel® R680E/Q670E/H610E PCH
•Max. 6 x COM, 3 x LAN, and 14 x USB ports (R680E/Q670E)
•1 x HDMI® & 3 x DP
•4 x PCIe & 4 x M.2 slots for versatile expansion (R680E/Q670E)
 System
 CPU Support  Intel® 14th/13th/12th Gen. (Socket LGA1700)
 Core™ i9/i7/i5/i3 & Pentium®/Celeron® Processors
 CPU List
 Intel® Core™

 i9-14900/T, 13900TE/E, 12900TE/E

 i7-14700/T, 13700TE/E, 12700TE/E

 i5-14500/T, 13500TE/E, 12500TE/E

 i3-14100/T, 13100TE/E, 12100TE/E

 Pentium® G7400TE/E

 Celeron® G6900TE/E

 (TDP 35W/65W)

 Chipset  Intel® R680E/Q670E/H610E PCH
 Memory Support  R680E:

  4 x DDR5 UDIMM 4400MHz (ECC/non-ECC, up to 192GB)

 Q670E:

  4 x DDR5 UDIMM 4400MHz (non-ECC, up to 192GB)

 H610E:

  2 x DDR5 UDIMM 4400MHz (non-ECC, up to 96GB)

 Storage

 4 x SATA3.0 ports

 RAID 0/1/5 supported (R680E/Q670E only)
 BIOS  AMI UEFI BIOS
 TPM  TPM 2.0
 Watchdog  1~255 seconds watchdog timer selectable
 FAN  2 x System Fan (4-pin wafer with Smart Fan function)
 1 x CPU Fan (4-pin wafer with Smart Fan function)
 Power Supply

 Flex ATX 20+4 pin

 Dimensions

 244 x 244 mm (9.6" x 9.6")

 Certifications

 CE, FCC

 O.S. Support

 Windows® 11 IoT Enterprise LTSC 2024

 Windows® 10 IoT Enterprise LTSC 2021

 Linux (Ubuntu 22.04 LTS)

 I/O

 USB

 R680E/Q670E:

  6 x USB 3.2 Gen2 (Rear I/O)

  4 x USB 2.0 (Rear I/O)

  2 x USB 3.2 Gen 2 (wafer)

  2 x USB 2.0 (1 x USB 2.0 shared with M.2 E-Key slot) (wafer)

 H610E:

  4 x USB 3.2 Gen1 (Rear I/O)

  4 x USB 2.0 (Rear I/O)

  2 x USB 2.0 (1 x USB 2.0 shared with M.2 E-Key slot) (wafer)

 Serial Ports

 6 x COM (wafer)

 COM1/2: RS-232/422/485, +5V/+12V selectable by jumper

 COM3/4/5/6: RS-232/422/485 

 Ethernet

 R680E/Q670E:

  3 x RJ-45 2.5GbE LAN ports (Rear I/O)

 H610E:

  2 x RJ-45 2.5GbE LAN ports (Rear I/O)

  Wake-On-LAN/PXE supported

 Digital I/O

 1 x Digital I/O (8-in/8-out) (pin header)

 I2C

 1 x I2C (wafer)

 Audio

 1 x Mic-in

 1 x Line-in

 1 x Line-out

 (Rear I/O)

 LPC

 1 x LPC (2x5 pin header) for debug only.

 Case Open

 1 x Case Open Detection (wafer)

 Expansion Slots

 

 PCIe

 R680E/Q670E:

  1 x PCIe x16 (Gen5)

  2 x PCIe x4 (Gen4)

  1 x PCIe x4 (Gen3)

 H610E:

  1 x PCIe x16 (Gen5)

  1 x PCIe x4 (Gen3) 

 M.2

 R680E/Q670E:

  1 x M.2 2230 E key (PCIe x1 / USB 2.0)

  1 x M.2 2242 B key (PCIe x2 / SATA 3.0)

  1 x M.2 2280 B key (PCIe x2 / SATA 3.0)

  (M.2 B Key supports RAID 0/1)

  1 x M.2 2280 M key slot (PCIe x4)

 H610E:

  1 x M.2 2230 E key (PCIe x1 / USB 2.0)

 Display

 Flexible Display

 Quadruple independent displays supported

 DisplayPort

 3 x DisplayPort / up to 4096 x 2304 @60Hz (Rear I/O)

 HDMI®

 1 x HDMI® / up to 4096 x 2160 @60Hz (Rear I/O)

 eDP / LVDS  1 x eDP/LVDS (optional) (pin header)

 -eDP up to 3840 x 2160 @60Hz

 -LVDS up to 1920 x 1200 @60Hz

 Environment
 Operating Temperature  0°C~60°C (32°F~140°F) @humidity 20%~90%
 Storage Temperature -40°C~85°C (-40°F~185°F) @humidity 20%~95%

 

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BU-K319 Highlight


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BU-K319 IO


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BU-K319 Dimensions

 
 BU-K319

Intel® 14th/13th/12th Gen. Core™ Processor Industrial Micro-ATX Motherboard

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